110 chidziwitso cha SMT chip processing - Gawo 1
1. Nthawi zambiri, kutentha kwa SMT Chip processing msonkhano ndi 25 ± 3 ℃;
2. Zida ndi zinthu zofunika posindikiza paste, monga solder phala, mbale yachitsulo, scraper, mapepala opukuta, mapepala opanda fumbi, zotsukira ndi mpeni wosakaniza;
3. Zomwe zimapangidwira za solder paste alloy ndi Sn / Pb alloy, ndipo gawo la alloy ndi 63/37;
4. Pali zigawo zikuluzikulu ziwiri mu solder phala, ena ndi malata ufa ndi flux.
5. Ntchito yaikulu ya flux mu kuwotcherera ndi kuchotsa okusayidi, kuwononga kunja kukangana kwa malata osungunuka ndi kupewa reoxidation.
6. The voliyumu chiŵerengero cha tini ufa particles kuti flux ndi za 1: 1 ndi chigawo chiŵerengero ndi za 9: 1;
7. Mfundo ya solder phala ndi koyamba kunja;
8. Pamene phala la solder likugwiritsidwa ntchito ku Kaifeng, liyenera kukhala lotenthetsa ndi kusakaniza kupyolera mu njira ziwiri zofunika;
9. Njira zodziwika zopangira mbale zachitsulo ndi: etching, laser ndi electroforming;
10. Dzina lonse la SMT chip processing ndi luso lapamwamba (kapena kukwera), lomwe limatanthawuza teknoloji yomatira (kapena kukwera) mu Chinese;
11. Dzina lonse la ESD ndi electrostatic discharge, kutanthauza electrostatic discharge mu Chinese;
12. Popanga pulogalamu ya zida za SMT, pulogalamuyi imaphatikizapo magawo asanu: data ya PCB;chizindikiro cha data;data feeder;deta ya puzzle;gawo la data;
13. Malo osungunuka a Sn / Ag / Cu 96.5 / 3.0 / 0.5 ndi 217c;
14. The ntchito wachibale kutentha ndi chinyezi wa mbali kuyanika uvuni ndi <10%;
15. Zida zopanda ntchito zomwe zimagwiritsidwa ntchito nthawi zambiri zimaphatikizapo kukana, capacitance, point inductance (kapena diode), etc.;zida zogwira ntchito zikuphatikizapo transistors, IC, etc;
16. Zopangira zazitsulo zomwe zimagwiritsidwa ntchito kawirikawiri za SMT ndi zitsulo zosapanga dzimbiri;
17. The makulidwe a ambiri ntchito SMT zitsulo mbale ndi 0.15mm (kapena 0.12mm);
18. Mitundu ya ma electrostatic charge imaphatikizapo mikangano, kulekana, kulowetsedwa, ma electrostatic conduction, etc.;mphamvu ya electrostatic charge pamakampani amagetsi ndi kulephera kwa ESD ndi kuyipitsidwa kwamagetsi;mfundo zitatu za kuchotsa electrostatic ndi electrostatic neutralization, grounding and shielding.
19. Kutalika kwa x m'lifupi la dongosolo la Chingerezi ndi 0603 = 0.06inch * 0.03inch, ndipo ya metric system ndi 3216 = 3.2mm * 1.6mm;
20. Code 8 "4" ya erb-05604-j81 imasonyeza kuti pali maulendo 4, ndipo mtengo wotsutsa ndi 56 ohm.Mphamvu ya eca-0105y-m31 ndi C = 106pf = 1NF = 1 × 10-6f;
21. Dzina lonse la Chitchaina la ECN ndi chidziwitso chosintha mainjiniya;dzina lathunthu lachi China la SWR ndi: dongosolo lantchito lomwe lili ndi zosowa zapadera, zomwe ndizofunikira kuti zisayinidwenso ndi madipatimenti oyenera ndikugawidwa pakati, zomwe ndizothandiza;
22. Zomwe zili mu 5S ndizoyeretsa, kusanja, kuyeretsa, kuyeretsa ndi khalidwe;
23. Cholinga cha PCB vacuum ma CD ndi kuteteza fumbi ndi chinyezi;
24. Ndondomeko ya khalidwe ndi: kuwongolera khalidwe lonse, kutsatira ndondomeko, kupereka khalidwe lofunidwa ndi makasitomala;ndondomeko ya kutenga nawo mbali kwathunthu, kusamalira nthawi yake, kukwaniritsa ziro chilema;
25. Malamulo atatu opanda khalidwe ndi awa: kusavomereza zinthu zolakwika, kupanga zinthu zolakwika komanso kusatuluka kwa zinthu zolakwika;
26. Pakati pa njira zisanu ndi ziwiri za QC, 4m1h imatanthawuza (Chinese): anthu, makina, zinthu, njira ndi chilengedwe;
27. Kuphatikizika kwa solder phala kumaphatikizapo: ufa wachitsulo, Rongji, flux, anti vertical flow agent ndi wothandizira;malinga ndi chigawocho, zitsulo za ufa zimakhala ndi 85-92%, ndipo voliyumu yowonjezera zitsulo ufa imakhala 50%;Pakati pawo, zigawo zikuluzikulu za ufa wachitsulo ndi malata ndi lead, gawo ndi 63/37, ndipo malo osungunuka ndi 183 ℃;
28. Mukamagwiritsa ntchito solder phala, ndikofunikira kuti mutulutse mufiriji kuti muchepetse kutentha.Cholinga chake ndikupangitsa kutentha kwa phala la solder kubwerera ku kutentha kwabwino kuti kusindikizidwe.Ngati kutentha sikunabwezedwe, solder bead ndi yosavuta kuchitika PCBA ikalowa reflow;
29. Mafomu operekera zikalata zamakinawa akuphatikizapo: mawonekedwe okonzekera, mawonekedwe oyankhulana patsogolo, mawonekedwe oyankhulana ndi mawonekedwe ofulumira;
30. Njira zoyikira PCB za SMT zikuphatikizapo: Kuyika kwa vacuum, kuyika mabowo pamakina, kuyika kwazitsulo ziwiri ndi kuyika m'mphepete mwa bolodi;
31. Kukaniza ndi chophimba cha silika cha 272 (chizindikiro) ndi 2700 Ω, ndipo chizindikiro (chithunzi cha silika) cha kukana ndi kukana mtengo wa 4.8m Ω ndi 485;
32. Kusindikiza kwa nsalu ya silika pa thupi la BGA kumaphatikizapo wopanga, nambala ya gawo la wopanga, muyezo ndi Datecode / (gawo no);
33. Pitch ya 208pinqfp ndi 0.5mm;
34. Pakati pa njira zisanu ndi ziwiri za QC, chithunzi cha fishbone chimayang'ana pakupeza ubale woyambitsa;
37. CPK imatanthawuza kuthekera kwa ndondomeko pansi pa zochitika zamakono;
38. Flux inayamba kutuluka m'madera otentha nthawi zonse pofuna kuyeretsa mankhwala;
39. Njira yabwino yoziziritsira zone ndi piritsi la reflux ndi zithunzi zagalasi;
40. Mpoto wa RSS ndi kutentha → kutentha kosasintha → reflux → kuzizira;
41. Zinthu za PCB zomwe tikugwiritsa ntchito ndi FR-4;
42. PCB warpage muyezo si upambana 0,7% ya diagonal ake;
43. The laser incision yopangidwa ndi stencil ndi njira yomwe imatha kukonzedwanso;
44. The awiri a BGA mpira amene nthawi zambiri ntchito pa bolodi waukulu kompyuta ndi 0.76mm;
45. ABS dongosolo ndi zabwino kugwirizana;
46. Cholakwika cha ceramic chip capacitor eca-0105y-k31 ndi ± 10%;
47. Panasert Matsushita zonse yogwira Mounter ndi voteji 3?200 ± 10 vac;
48. Pakuyika kwa magawo a SMT, kutalika kwa tepiyo ndi mainchesi 13 ndi mainchesi 7;
49. Kutsegula kwa SMT nthawi zambiri kumakhala 4um kakang'ono kuposa PCB pad, yomwe ingapewe kuoneka kwa mpira wosauka wa solder;
50. Malinga ndi malamulo PCBA kuyendera, pamene dihedral ngodya ndi madigiri oposa 90, izo zikusonyeza kuti solder phala alibe adhesion kwa yoweyula solder thupi;
51. IC ikatha kutsegulidwa, ngati chinyezi pa khadi ndi chachikulu kuposa 30%, chimasonyeza kuti IC ndi yonyowa komanso ya hygroscopic;
52. The olondola chigawo chiŵerengero ndi voliyumu chiŵerengero cha malata ufa kuti flux mu solder phala ndi 90%: 10%, 50%: 50%;
53. Maluso omangirira owoneka koyambirira adachokera kumagulu ankhondo ndi Avionics mkatikati mwa 1960s;
54. Zomwe zili mu Sn ndi Pb mu solder phala zomwe zimagwiritsidwa ntchito kwambiri mu SMT ndizosiyana.
Nthawi yotumiza: Sep-29-2020