Mitundu ya 4 ya SMT Rework Equipment

Malo opangira ma SMT amatha kugawidwa m'mitundu 4 molingana ndi kapangidwe kawo, kagwiritsidwe ntchito ndi zovuta zake: mtundu wosavuta, mtundu wovuta, mtundu wa infrared ndi mtundu wa mpweya wotentha wa infrared.

1. Mtundu wosavuta: zida zamtunduwu ndizofala kwambiri kuposa ntchito yodziyimira payokha yachitsulo, imatha kusankha kugwiritsa ntchito mawonekedwe osiyanasiyana amutu wachitsulo malinga ndi mawonekedwe achigawo, gawo la dongosolo ndi nsanja yokhazikika ya PCB, makamaka podutsa dzenje. Kutentha kwagawo, chip soldering ndi kuchotsa chip, etc.

2. Complex mtundu: zovuta mtundu reworking zipangizo ndi yosavuta mtundu reworking zida, poyerekeza ndi onse akhoza disassemble zigawo zikuluzikulu, malo ❖ kuyanika solder phala, okwera zigawo zikuluzikulu ndi zigawo kuwotcherera, wovuta kwambiri ndi fano udindo dongosolo, dongosolo kutentha kulamulira, ankalamulira zingalowe suction ndi makina otulutsa, ndi zina zotere. Zida zamtunduwu makamaka zimakhala ndi chipangizo chopangiranso GOOT,BGA reworking station, ndi zina.

3. Mtundu wa infuraredi: zida za infrared rework rework makamaka kugwiritsa ntchito infuraredi cheza Kutentha kwenikweni kuti amalize kukonzanso kwa zigawo, infuraredi radiation Kutentha kwenikweni kumakhala kofanana, palibe choziziritsa m'deralo chomwe chimachitika pamene kutentha kwa mpweya wotentha kumatuluka, kutentha koyambilira pang'onopang'ono, Kutentha mochedwa mofulumira, kulowa ndi mphamvu, koma rework kangapo bolodi PCB n'zosavuta chifukwa delamination kudzera dzenje sachiza.

4. Mtundu wa mpweya wotentha wa infuraredi: zida za infuraredi zotentha zamtundu wa rework pogwiritsa ntchito kutenthetsa kwa infuraredi ndi matenthedwe ang'onoang'ono kuti agwiritsenso ntchito, kuyang'ana ubwino wa zida za infuraredi ndi mpweya wotentha.Ngati mumagwiritsa ntchito infuraredi mosalekeza Kutentha, zosavuta kutsogolera kusakhazikika kutentha, infuraredi Kutentha pamwamba adzakhala ndi lalikulu, ndiye ena mwa bolodi potting ngati si kutetezedwa, BGA adzatsogolera ozungulira Chip kuphulika malata, monga kukonza laputopu ndi zambiri. osati kutentha kwathunthu kwa infuraredi, koma kugwiritsa ntchito kutentha kwa infuraredi kophatikizana kwa mpweya wotentha.

Makhalidwe aNeoDenBGA rework station

Kupereka Mphamvu: AC220V±10%, 50/60HZ

Mphamvu: 5.65KW(Max) ,chotentha chapamwamba (1.45KW)

Chotenthetsera chapansi (1.2KW), IR Preheater (2.7KW), Zina (0.3KW)

Kukula kwa PCB: 412 * 370mm (Max); 6 * 6mm (Mphindi)

BGA Chip Kukula: 60 * 60mm (Max); 2 * 2mm (Mphindi)

IR Heater Kukula: 285 * 375mm

Sensor Kutentha: 1 pcs

Njira Yogwirira Ntchito: 7 ″ HD touch screen

Control System: Autonomous heat control system V2 (software copyright)

Sonyezani Dongosolo: 15 ″ SD mafakitale chiwonetsero (720P kutsogolo chophimba)

Dongosolo Loyang'anira: Makina oyerekeza a digito a Pixel 2 SD, mawonekedwe owoneka bwino okhala ndi laser: chizindikiro cha dontho lofiira

Vacuum Adsorption: Automatic

Kuyanjanitsa Kulondola: ± 0.02mm

Kuwongolera Kutentha: K-mtundu wa thermocouple wotseka-loop kuwongolera molondola mpaka ± 3 ℃

Chida Chodyetsa: Ayi

Kuyika: V-groove yokhala ndi mawonekedwe onse