Gawo laling'ono kapena lapakati ndi gawo lofunika kwambiri la phukusi la BGA, lomwe lingagwiritsidwe ntchito poyang'anira zowonongeka ndi kuphatikizira kwa inductor / resistor / capacitor kuwonjezera pa mawaya ogwirizanitsa.Chifukwa chake, gawo lapansili limayenera kukhala ndi kutentha kwa kutentha kwa magalasi rS (pafupifupi 175 ~ 230 ℃), kukhazikika kwapamwamba komanso kuyamwa kochepa kwa chinyezi, magwiridwe antchito abwino amagetsi komanso kudalirika kwakukulu.Filimu yachitsulo, wosanjikiza ndi gawo laling'ono media ayeneranso kukhala ndi katundu womatira kwambiri pakati pawo.
1. The ma CD ndondomeko ya kutsogolera womangidwa PBGA
① Kukonzekera kwa gawo lapansi la PBGA
Laminate woonda kwambiri (12 ~ 18μm wandiweyani) zojambula zamkuwa mbali zonse za BT utomoni/galasi pachimake bolodi, ndiye kubowola mabowo ndi kudzera-bowo zitsulo.Njira yodziwika bwino ya PCB kuphatikiza 3232 imagwiritsidwa ntchito popanga zithunzi mbali zonse za gawo lapansi, monga mizere yowongolera, maelekitirodi, ndi magawo am'dera la solder pakuyika mipira yogulitsira.Chigoba cha solder chimawonjezeredwa ndipo zojambulazo zimapangidwira kuti ziwonetsere maelekitirodi ndi malo ogulitsa.Kupititsa patsogolo kupanga bwino, gawo lapansi nthawi zambiri limakhala ndi magawo angapo a PBG.
② Kuyenda kwa Package
Kupatulira mkate → kudula poto → kugwirizanitsa chip → kuyeretsa madzi a m'magazi → kulumikiza kutsogolo → kuyeretsa madzi a m'magazi → phukusi loumbidwa → kusonkhanitsa mipira yogulitsira → kutenthetsa ng'anjo → kuyika pamwamba → kupatukana → kuyang'ana komaliza → kuyezetsa kabati
Chip bonding imagwiritsa ntchito zomatira za epoxy zodzaza ndi siliva kuti zimangirire chip IC ku gawo lapansi, ndiye kulumikiza waya wagolide kumagwiritsidwa ntchito kuzindikira kugwirizana pakati pa chip ndi gawo lapansi, ndikutsatiridwa ndi pulasitiki yopangidwa ndi pulasitiki kapena zomatira zamadzimadzi kuteteza chip, mizere yogulitsa. ndi pads.Chida chonyamula chopangidwa mwapadera chimagwiritsidwa ntchito kuyika mipira yogulitsira 62/36/2Sn/Pb/Ag kapena 63/37/Sn/Pb yokhala ndi malo osungunuka a 183°C ndi m'mimba mwake 30 mil (0.75mm) pa pads, ndi reflow soldering ikuchitika mu uvuni wamba reflow, ndi kutentha kwambiri processing wosapitirira 230 ° C.Gawo lapansili limatsukidwa mozama ndi CFC chotsukira zinthu zachilengedwe kuti achotse particles za solder ndi fiber zomwe zatsala pa phukusi, ndikutsatiridwa ndi kuyika chizindikiro, kulekanitsa, kuwunika komaliza, kuyezetsa, ndikuyika kuti zisungidwe.Pamwambapa ndi ma CD ndondomeko kutsogolera kugwirizana mtundu PBGA.
2. Kuyika kwa FC-CBGA
① Ceramic gawo lapansi
Gawo la FC-CBGA ndi multilayer ceramic substrate, yomwe ndizovuta kupanga.Chifukwa gawo lapansili lili ndi kachulukidwe ka mawaya apamwamba, katalikirana kakang'ono, ndipo ambiri kudutsa mabowo, komanso kufunikira kwa coplanarity wa gawo lapansi ndikwambiri.Njira yake yaikulu ndi: choyamba, mapepala a multilayer ceramic amawotchedwa pa kutentha kwakukulu kuti apange multilayer ceramic metallized substrate, ndiye mawaya azitsulo a multilayer amapangidwa pa gawo lapansi, ndiyeno plating ikuchitika, etc. Mu msonkhano wa CBGA , kusagwirizana kwa CTE pakati pa gawo lapansi ndi chip ndi bolodi la PCB ndiye chinthu chachikulu chomwe chimayambitsa kulephera kwa zinthu za CBGA.Kuti izi zitheke, kuwonjezera pa kapangidwe ka CCGA, gawo lina la ceramic, gawo la HITCE ceramic substrate, lingagwiritsidwe ntchito.
②Njira yonyamula katundu
Kukonzekera kwa ma disc -> disc kudula -> chip flip-flop ndi reflow soldering -> kudzaza pansi kwa mafuta otentha, kugawa kwa solder yosindikiza -> kuyika -> kusonkhanitsa mipira ya solder -> reflow soldering -> kuika chizindikiro -> kupatukana -> kuyendera komaliza -> kuyesa -> kuyika
3. The ma CD ndondomeko ya lead bonding TBGA
① TBGA chonyamulira tepi
Tepi yonyamulira ya TBGA nthawi zambiri imapangidwa ndi zinthu za polyimide.
Popanga, mbali zonse ziwiri za tepi yonyamulira zimakutidwa ndi mkuwa, kenako faifi tambala ndi golide, ndikutsatiridwa ndi kubowola ndikubowola zitsulo ndi kupanga zojambulajambula.Chifukwa mu TBGA yolumikizidwa ndi TBGA, choyikira chotenthetsera chimakhalanso chokhazikika komanso cholimba komanso gawo lapakati la chipolopolo cha chubu, kotero tepi yonyamulirayo imamangirira kukuya kwa kutentha pogwiritsa ntchito zomatira zovutirapo musanatseke.
② Encapsulation process flow
Kupatulira chip → kudula tchipisi → kulumikiza chip → kuyeretsa → kulumikizana ndi lead → kuyeretsa plasma → poto wamadzimadzi osindikizira → kuphatikiza mipira yogulitsira → kugulitsanso → kuyika pamwamba → kulekanitsa → kuyezetsa komaliza → kuyezetsa → kuyika
Zhejiang NeoDen Technology Co., LTD., yomwe idakhazikitsidwa mu 2010, ndi katswiri wopanga makina opangira ma SMT ndi malo, uvuni wa reflow, makina osindikizira a stencil, chingwe chopangira SMT ndi Zida zina za SMT.
Timakhulupirira kuti anthu abwino ndi othandizana nawo amapangitsa NeoDen kukhala kampani yabwino komanso kuti kudzipereka kwathu ku Innovation, Diversity and Sustainability kumawonetsetsa kuti makina a SMT azitha kupezeka kwa aliyense wokonda zosangalatsa kulikonse.
Onjezani: No.18, Tianzihu Avenue, Tianzihu Town, Anji County, Huzhou City, Province la Zhejiang, China
Foni: 86-571-26266266
Nthawi yotumiza: Feb-09-2023