Zoyipa zamapaketi makamaka zimaphatikizira kusinthika kwa lead, base offset, warpage, chip breakage, delamination, voids, ma CD osagwirizana, ma burrs, tinthu takunja ndi kuchiritsa kosakwanira, ndi zina zambiri.
1. Kusintha kwa kutsogolera
Kupindika kwa lead nthawi zambiri kumatanthawuza kusuntha kwa kutsogolera kapena kupindika komwe kumachitika panthawi ya pulasitiki yosindikizira, yomwe nthawi zambiri imasonyezedwa ndi chiŵerengero cha x / L pakati pa maulendo apamwamba otsogolera x ndi kutalika kwa L. mu kachulukidwe kachipangizo ka I/O phukusi).Nthawi zina kupsinjika komwe kumabwera chifukwa chopindika kungayambitse kusweka kwa malo omangira kapena kuchepetsa mphamvu ya ma bond.
Zinthu zomwe zimakhudza kulumikizana ndi kutsogolera zikuphatikiza kapangidwe ka phukusi, kapangidwe ka kutsogolera, zinthu zotsogola ndi kukula kwake, kuumba katundu wapulasitiki, njira yolumikizira kutsogolera, ndi kuyika.Magawo otsogolera omwe amakhudza kupindika kwa kutsogolera kumaphatikizapo m'mimba mwake, kutalika kwa kutsogolera, kuledzera kwanthawi yayitali ndi kachulukidwe ka lead, etc.
2. Base offset
Base offset imatanthawuza kusinthika ndi kusinthika kwa chonyamulira (chip base) chomwe chimathandizira chip.
Zinthu zomwe zimakhudza kusuntha kwa maziko kumaphatikizapo kuyenda kwa makina opangira, mapangidwe a msonkhano wa leadframe, ndi zinthu zakuthupi zomwe zimapangidwira ndi leadframe.Maphukusi monga TSOP ndi TQFP amatha kusintha kusintha kwa ma pini ndi mapini chifukwa cha zowongolera zawo zoonda.
3. Nkhondo
Warpage ndikupindika kunja kwa ndege ndikupindika kwa chipangizo cha phukusi.Warpage yomwe imabwera chifukwa cha kuumba imatha kubweretsa zinthu zingapo zodalirika monga delamination ndi chip cracking.
Warpage kungachititsenso kuti mavuto osiyanasiyana kupanga, monga mu plasticized mpira gululi gulu (PBGA) zipangizo, kumene warpage kungayambitse osauka solder mpira coplanarity, kuchititsa mavuto makhazikitsidwe pa reflow wa chipangizo msonkhano kwa gulu losindikizidwa dera.
Mawonekedwe a Warpage amaphatikizapo mitundu itatu ya mapangidwe: mkati mwa concave, kunja kwa convex ndi kuphatikiza.M'makampani a semiconductor, concave nthawi zina amatchedwa "nkhope yakumwetulira" ndi convex ngati "nkhope yolira".Zomwe zimachititsa kuti tsamba lankhondo likhale losagwirizana ndi CTE komanso kuchiritsa / kuponderezana shrinkage.Otsatirawa sanalandire chidwi chochuluka poyamba, koma kafukufuku wozama adawonetsa kuti kuchepa kwa mankhwala a chigawo chowumbidwa kumathandizanso kwambiri pa IC chipangizo warpage, makamaka m'maphukusi okhala ndi makulidwe osiyanasiyana pamwamba ndi pansi pa chip.
Pakuchiritsa ndi kuchiritsa pambuyo pochiritsa, chigawo chowumbidwacho chidzakhala ndi shrinkage yamankhwala pa kutentha kwakukulu, komwe kumatchedwa "thermochemical shrinkage".Kuchepa kwa mankhwala komwe kumachitika panthawi yochiritsa kumatha kuchepetsedwa powonjezera kutentha kwa magalasi ndikuchepetsa kusinthika kwa coefficient of thermal kukulitsa kuzungulira Tg.
Warpage ingathenso kuyambitsidwa ndi zinthu monga momwe zimapangidwira pawiri, chinyezi mumagulu opangira, ndi geometry ya phukusi.Ndi kulamulira akamaumba zinthu ndi zikuchokera, magawo ndondomeko, dongosolo phukusi ndi chisanadze encapsulation chilengedwe, phukusi warpage akhoza kuchepetsedwa.Nthawi zina, tsamba lankhondo likhoza kulipidwa mwa kuyika kumbuyo kwa msonkhano wamagetsi.Mwachitsanzo, ngati maulumikizidwe akunja a bolodi lalikulu la ceramic kapena bolodi la multilayer ali mbali imodzi, kuziyika kumbuyo kungachepetse tsamba lankhondo.
4. Kusweka kwa chips
Zopsinjika zomwe zimapangidwira pakulongedza zimatha kuyambitsa kuwonongeka kwa chip.Njira yoyikamo nthawi zambiri imakulitsa ming'alu yaying'ono yomwe idapangidwa mumsonkhano wapitawu.Wafer kapena chip kupatulira, kugaya kumbuyo, ndi chip bonding ndi njira zonse zomwe zingayambitse kuphuka kwa ming'alu.
Chip chosweka, cholephera mwamakina sichimapangitsa kuti magetsi azilephera.Kaya kuphulika kwa chip kudzachititsa kuti chipangizochi chiwonongeke nthawi yomweyo zimadaliranso njira ya kukula kwa mng'alu.Mwachitsanzo, ngati mng'alu ukuwonekera kuseri kwa chip, sizingakhudze zida zilizonse zokhudzidwa.
Chifukwa zowotcha za silicon ndi zoonda komanso zonyezimira, zoyikapo zawafer-level ndizovuta kwambiri kuphulika kwa chip.Choncho, ndondomeko magawo monga clamping kuthamanga ndi akamaumba kusintha kusintha kukakamiza mu kulanda akamaumba ndondomeko ayenera mosamalitsa ankalamulira kuteteza Chip kuphulika.Maphukusi ophatikizidwa a 3D amatha kusweka chifukwa cha kusungika.Zomwe zimapangidwira zomwe zimakhudza kuphulika kwa chip mu phukusi la 3D zikuphatikiza kapangidwe ka chip stack, makulidwe a gawo lapansi, voliyumu yowumba ndi makulidwe a manja a nkhungu, ndi zina zambiri.
Nthawi yotumiza: Feb-15-2023