Gulu la Zowonongeka Zopaka (II)

5. Delamination

Delamination kapena kusalumikizana bwino kumatanthawuza kulekanitsa pakati pa chosindikizira pulasitiki ndi mawonekedwe ake oyandikana nawo.Delamination ikhoza kuchitika m'dera lililonse la chipangizo chopangidwa ndi microelectronic;Zitha kuchitikanso panthawi ya encapsulation, post-encapsulation kupanga gawo, kapena panthawi yogwiritsira ntchito chipangizo.

Kusalumikizana bwino kolumikizana komwe kumachitika chifukwa cha njira ya encapsulation ndizomwe zimapangitsa kuti delamination.Kusokonekera kwa mawonekedwe, kuipitsidwa kwamadzi panthawi yotsekeredwa, komanso kuchira kosakwanira kungayambitse kusagwirizana.Zinthu zina zomwe zimakhudzana ndi kupsinjika kwa shrinkage ndi warpage pakuchiritsa ndi kuziziritsa.Kusagwirizana kwa CTE pakati pa chosindikizira pulasitiki ndi zinthu zoyandikana ndi nthawi yozizira kungayambitsenso kupsinjika kwamakina, komwe kumatha kupangitsa kuti delamination.

6. Zosowa

Ma voids amatha kuchitika pamlingo uliwonse wa encapsulation, kuphatikiza kusamutsa akamaumba, kudzaza, kupotoza, ndi kusindikiza pagulu lowumba kukhala malo amlengalenga.Voids amatha kuchepetsedwa pochepetsa kuchuluka kwa mpweya, monga kutuluka kapena kupukuta.Kupanikizika kwa vacuum kuyambira 1 mpaka 300 Torr (760 Torr kwa mpweya umodzi) kwanenedwa kuti kukugwiritsidwa ntchito.

Kusanthula kwa filler kukuwonetsa kuti ndikulumikizana kwa pansi kusungunula kutsogolo ndi chip komwe kumapangitsa kuti kuyenda kusokonezeke.Gawo la kutsogolo losungunuka limayenda m'mwamba ndikudzaza pamwamba pa theka kufa kudzera pa malo otseguka omwe ali m'mphepete mwa chip.The kumene anapanga Sungunulani kutsogolo ndi adsorbed Sungunulani kutsogolo kulowa pamwamba pa theka kufa, chifukwa matuza.

7. Kuyika mosagwirizana

Kuchuluka kwa phukusi losakhala yunifolomu kumatha kubweretsa tsamba lankhondo ndi delamination.Ukadaulo wapakatikati wopaka, monga kusamutsa, kuponderezana, ndi matekinoloje ophatikizira olowetsedwa, sangathe kutulutsa zolakwika zamapaketi ndi makulidwe osafanana.Kuyika kwa Wafer-level kumakhala kosavuta kwambiri kuchulukira kwa plastisol chifukwa cha machitidwe ake.

Pofuna kuonetsetsa kuti chisindikizo chikhale cholimba, chonyamulira chophatikiziracho chiyenera kukhazikika ndikupendekeka pang'ono kuti ziwongolere kukwera kwa squeegee.Kuonjezera apo, kulamulira kwa malo a squeegee kumafunika kuti zitsimikizire kukhazikika kwa squeegee kuti mupeze makulidwe a chisindikizo chofanana.

Heterogeneous kapena inhomogeneous zinthu zikuchokera zingachititse pamene filler particles kusonkhanitsa m'madera localized a akamaumba pawiri ndi kupanga sanali yunifolomu kugawa pamaso kuumitsa.Kusakanikirana kosakwanira kwa chosindikizira cha pulasitiki kumapangitsa kuti pakhale mawonekedwe osiyanasiyana mu encapsulation ndi potting process.

8. Mphepete mwaiwisi

Burrs ndi pulasitiki yopangidwa yomwe imadutsa pamzere wolekanitsa ndipo imayikidwa pazikhomo za chipangizo panthawi youmba.

Kuthamanga kosakwanira kwa clamping ndiko chifukwa chachikulu cha ma burrs.Ngati zotsalira zakuthupi zomwe zimapangidwira pazikhomo sizikuchotsedwa panthawi, zidzabweretsa mavuto osiyanasiyana pamsonkhano.Mwachitsanzo, kulumikizana kosakwanira kapena kumamatira mu gawo lotsatira lazopaka.Kutayikira kwa resin ndi mtundu wocheperako wa ma burrs.

9. Tinthu zachilendo

Pakuyikapo, ngati zinthu zolongedzazo zimakhudzidwa ndi chilengedwe, zida kapena zida zoipitsidwa, tinthu tating'onoting'ono timafalikira mu phukusi ndikusonkhanitsa pazigawo zachitsulo mkati mwa phukusi (monga chip IC ndi mfundo zomangira zotsogolera), zomwe zimatsogolera ku dzimbiri ndi zina. mavuto odalirika.

10. Kuchiza kosakwanira

Kusakwanira kwa nthawi yochiritsa kapena kutentha kochepa kwa machiritso kungayambitse kuchiritsa kosakwanira.Kuonjezera apo, kusintha pang'ono kwa chiŵerengero chosakanikirana pakati pa ma encapsulants awiriwo kudzatsogolera kuchiritsa kosakwanira.Kuti muwonjezere katundu wa encapsulant, ndikofunika kuonetsetsa kuti encapsulant imachiritsidwa mokwanira.Mu njira zambiri za encapsulation, kuchiritsa pambuyo kumaloledwa kutsimikizira kuchiritsa kwathunthu kwa encapsulant.Ndipo kusamala kuyenera kuchitidwa kuti zitsimikizidwe kuti ma ecapsulant ratios akufanana molondola.