1. BGA (gululi gululi)
Chiwonetsero chokhudzana ndi mpira, imodzi mwamapaketi amtundu wa pamwamba.Mabampu a mpira amapangidwa kumbuyo kwa gawo lapansi losindikizidwa kuti alowe m'malo mwa zikhomo motsatira njira yowonetsera, ndipo chipangizo cha LSI chimasonkhanitsidwa kutsogolo kwa gawo lapansi losindikizidwa ndikusindikizidwa ndi utomoni wopangidwa kapena njira yophika.Izi zimatchedwanso bump display carrier (PAC).Mapini amatha kupitirira 200 ndipo ndi mtundu wa phukusi lomwe limagwiritsidwa ntchito pa ma LSI a ma pini ambiri.Thupi la phukusi likhoza kupangidwanso laling'ono kuposa QFP (quad side pin flat package).Mwachitsanzo, BGA ya pini 360 yokhala ndi malo a pini 1.5mm ndi masikweya 31mm, pomwe QFP ya 304-pini yokhala ndi malo a pini 0.5mm ndi masikweya 40mm.Ndipo BGA sayenera kudandaula za kusintha kwa pini ngati QFP.Phukusili lidapangidwa ndi Motorola ku United States ndipo idakhazikitsidwa koyamba pazida monga mafoni am'manja, ndipo ikuyenera kukhala yotchuka ku United States pamakompyuta apatsogolo.Poyambirira, pini (bump) mtunda wapakati wa BGA ndi 1.5mm ndipo chiwerengero cha mapini ndi 225. 500-pin BGA ikupangidwanso ndi ena opanga LSI.vuto la BGA ndi kuyendera maonekedwe pambuyo reflow.
2. BQFP(phukusi la quad flat yokhala ndi bumper)
Phukusi la quad flat yokhala ndi bumper, imodzi mwamaphukusi a QFP, imakhala ndi mabampu (bumper) pamakona anayi a phukusilo kuti apewe kupindika kwa zikhomo panthawi yotumiza.Opanga semiconductor aku US amagwiritsa ntchito phukusili makamaka m'mabwalo monga ma microprocessors ndi ma ASIC.Pin pakati mtunda 0.635mm, chiwerengero cha zikhomo kuchokera 84 mpaka 196 kapena choncho.
3. Bump solder PGA(butt joint pin grid array) Dzina lofanana ndi pamwamba phiri PGA.
4. C-(ceramic)
Chizindikiro cha paketi ya ceramic.Mwachitsanzo, CDIP imatanthawuza ceramic DIP, yomwe imagwiritsidwa ntchito nthawi zambiri.
5. Cerdip
Ceramic double in-line phukusi losindikizidwa ndi galasi, lomwe limagwiritsidwa ntchito pa ECL RAM, DSP (Digital Signal processor) ndi mabwalo ena.Cerdip yokhala ndi zenera lagalasi imagwiritsidwa ntchito pamtundu wa UV erasure EPROM ndi mabwalo apakompyuta ang'onoang'ono okhala ndi EPROM mkati.Mtunda wapakati wa pini ndi 2.54mm ndipo chiwerengero cha mapini chimachokera 8 mpaka 42.
6. Cerquad
Imodzi mwamaphukusi okwera pamwamba, ceramic QFP yokhala ndi underseal, imagwiritsidwa ntchito kuyika mabwalo a LSI monga ma DSP.Cerquad yokhala ndi zenera imagwiritsidwa ntchito kuyika mabwalo a EPROM.Kutentha kwa kutentha kuli bwino kuposa ma QFP apulasitiki, kulola mphamvu ya 1.5 mpaka 2W pansi pazikhalidwe zoziziritsa mpweya wachilengedwe.Komabe, mtengo wa phukusi ndi 3 mpaka 5 kuposa ma QFP apulasitiki.Pin center mtunda ndi 1.27mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, etc. Chiwerengero cha mapini chimachokera ku 32 mpaka 368.
7. CLCC (ceramic leaded chip chonyamulira)
Ceramic leaded chip chonyamulira ndi zikhomo, imodzi mwa phukusi pamwamba phiri, zikhomo amatsogozedwa mbali zinayi za phukusi, mu mawonekedwe a ding.Ndi zenera kwa phukusi la UV erasure mtundu EPROM ndi microcomputer dera ndi EPROM, etc.. Phukusili amatchedwanso QFJ, QFJ-G.
8. COB (chip pa bolodi)
Chip pa board board ndi imodzi mwaukadaulo woyika chip, semiconductor chip imayikidwa pa bolodi losindikizidwa, kulumikizana kwamagetsi pakati pa chip ndi gawo lapansi kumazindikirika ndi njira yosokera, kulumikizana kwamagetsi pakati pa chip ndi gawo lapansi kumazindikirika ndi njira yolumikizira kutsogolera. , ndipo imakutidwa ndi utomoni kuti itsimikizire kudalirika.Ngakhale COB ndiye ukadaulo wosavuta kwambiri woyika tchipisi, koma kachulukidwe kake kake ndi kotsika kwambiri poyerekeza ndi TAB komanso ukadaulo wosinthika wa chip soldering.
9. DFP(pawiri lathyathyathya phukusi)
Phukusi lathyathyathya lambali lawiri.Ndi dzina la SOP.
10. DIC (pawiri mumzere ceramic phukusi)
Ceramic DIP (yokhala ndi galasi seal) alias.
11. DIL (awiri pamzere)
DIP alias (onani DIP).Opanga semiconductor aku Europe nthawi zambiri amagwiritsa ntchito dzinali.
12. DIP(paketi yapawiri yamzere)
Paketi yapamzere iwiri.Mmodzi wa phukusi katiriji, zikhomo amatsogozedwa mbali zonse za phukusi, zinthu phukusili ali mitundu iwiri ya pulasitiki ndi ceramic.DIP ndi phukusi lodziwika bwino la cartridge, ntchito zikuphatikizapo logic yokhazikika IC, kukumbukira LSI, maulendo a microcomputer, ndi zina zotero .mapaketi ena okhala ndi m'lifupi mwake 7.52mm ndi 10.16mm amatchedwa Slim DIP ndi DIP slim motsatana.Kuphatikiza apo, ma DIP a ceramic osindikizidwa ndi magalasi otsika osungunuka amatchedwanso cerdip (onani cerdip).
13. DSO (zotulutsa zazing'ono ziwiri)
Dzina loti SOP (onani SOP).Ena opanga semiconductor amagwiritsa ntchito dzinali.
14. DICP (pawiri tepi chonyamulira phukusi)
Imodzi mwa TCP (zonyamula tepi).Zikhomozo zimapangidwa pa tepi yotetezera ndipo zimatuluka mbali zonse za phukusi.Chifukwa chogwiritsa ntchito ukadaulo wa TAB (automatic tepi carrier soldering), mbiri ya phukusi ndi yopyapyala kwambiri.Amagwiritsidwa ntchito kwambiri pa ma LCD driver LSIs, koma ambiri amapangidwa mwamakonda.Kuphatikiza apo, phukusi la 0.5mm lachidziwitso cha LSI lachidziwitso likupangidwa.Ku Japan, DICP imatchedwa DTP molingana ndi muyezo wa EIAJ (Electronic Industries and Machinery of Japan).
15. DIP (zonyamula tepi ziwiri)
Momwemonso pamwambapa.Dzina la DTCP mu muyezo wa EIAJ.
16. FP (phukusi lathyathyathya)
Phukusi lathyathyathya.Dzina la QFP kapena SOP (onani QFP ndi SOP).Ena opanga semiconductor amagwiritsa ntchito dzinali.
17. chipwirikiti
Flip-chip.Imodzi mwa matekinoloje opangira ma bare-chip momwe chitsulo chimapangidwira m'dera la electrode la LSI chip ndiyeno chitsulo chachitsulo chimagulitsidwa kudera la electrode pagawo losindikizidwa.Dera lokhala ndi phukusili ndi lofanana ndi kukula kwa chip.Ndilo laling'ono kwambiri komanso lochepa kwambiri pa matekinoloje onse opaka.Komabe, ngati coefficient of thermal extension of the substrate ndi yosiyana ndi ya LSI chip, imatha kuchitapo kanthu polumikizana ndipo motero imakhudza kudalirika kwa kulumikizana.Chifukwa chake, ndikofunikira kulimbitsa chip LSI ndi utomoni ndikugwiritsa ntchito gawo lapansi lomwe lili ndi pafupifupi coefficient yofanana yakukulitsa kutentha.
18. FQFP (phukusi labwino la phula la quad)
QFP yokhala ndi mtunda wapakati wa pini, nthawi zambiri zosakwana 0.65mm (onani QFP).Opanga makondakitala ena amagwiritsa ntchito dzinali.
19 CPAC
Motorola's alias ya BGA.
20. CQFP (quad fiat phukusi ndi mphete ya alonda)
Phukusi la Quad Fiat yokhala ndi mphete ya alonda.Imodzi mwama QFP apulasitiki, zikhomozo zimakutidwa ndi mphete yotchinga yotchinga kuti ipewe kupindika ndi kupunduka.Musanasonkhanitse LSI pagawo losindikizidwa, zikhomo zimadulidwa kuchokera ku mphete ya alonda ndikupangidwa kukhala mapiko a seagull (L-mawonekedwe).Phukusili likupangidwa mochuluka ku Motorola, USA.Mtunda wapakati wa pini ndi 0.5mm, ndipo kuchuluka kwa zikhomo ndi pafupifupi 208.
21. H- (ndi sinki yotentha)
Imawonetsa chizindikiro chokhala ndi sinki yotentha.Mwachitsanzo, HSOP imasonyeza SOP ndi sink ya kutentha.
22. Pini gululi (mtundu wokwera pamwamba)
Pamwamba phiri mtundu PGA kawirikawiri katiriji mtundu phukusi ndi pini kutalika pafupifupi 3.4mm, ndi pamwamba phiri mtundu PGA ali ndi mawonetseredwe zikhomo pansi mbali ya phukusi ndi kutalika kwa 1.5mm kuti 2.0mm.Popeza mtunda wapakati wa pini ndi 1.27mm, womwe ndi theka la kukula kwa cartridge ya PGA, thupi la phukusi likhoza kukhala laling'ono, ndipo chiwerengero cha pini chimaposa mtundu wa cartridge (250-528) ndiye phukusi lomwe limagwiritsidwa ntchito pamalingaliro akulu a LSI.Magawo a phukusi ndi ma multilayer ceramic substrates ndi magalasi osindikizira a epoxy resin.Kupanga mapaketi okhala ndi ma multilayer ceramic substrates kwakhala kothandiza.
23. JLCC (J-lead chip chonyamulira)
Chonyamulira chipini chooneka ngati J.Amatanthauza CLCC yokhala ndi zenera ndi mawindo a ceramic QFJ alias (onani CLCC ndi QFJ).Ena mwa opanga ma semi-conductor amagwiritsa ntchito dzinali.
24. LCC (chonyamulira chip chopanda kutsogolo)
Pinless chip chonyamulira.Amatanthauza pamwamba phiri phukusi limene maelekitirodi okha mbali zinayi za gawo lapansi ceramic ndi kukhudzana popanda zikhomo.Phukusi la IC yothamanga kwambiri komanso yothamanga kwambiri, yomwe imadziwikanso kuti ceramic QFN kapena QFN-C.
25. LGA (land grid array)
Lumikizanani ndi phukusi lowonetsera.Ndi phukusi kuti ali osiyanasiyana kulankhula pansi mbali.Akasonkhanitsidwa, amatha kulowetsedwa muzitsulo.Pali zolumikizana 227 (mtunda wapakati wa 1.27mm) ndi zolumikizira 447 (mtunda wapakati wa 2.54mm) za LGAs za ceramic, zomwe zimagwiritsidwa ntchito pamayendedwe othamanga kwambiri a LSI.Ma LGA amatha kukhala ndi mapini owonjezera ndi zotulutsa mu phukusi laling'ono kuposa ma QFP.Kuonjezera apo, chifukwa cha kutsika kochepa kwa otsogolera, ndi oyenera LSI yothamanga kwambiri.Komabe, chifukwa cha zovuta komanso kukwera mtengo kwazitsulo, sizikugwiritsidwa ntchito kwambiri tsopano.Kufuna kwawo kukuyembekezeka kuwonjezeka mtsogolomu.
26 LOC (kutsogolera pa chip)
Ukadaulo wamapakisi wa LSI ndi kapangidwe komwe kutsogolo kwa chimango chotsogolera kumakhala pamwamba pa chip ndipo cholumikizira cholumikizira chimapangidwa pafupi ndi pakati pa chip, ndipo kulumikizana kwamagetsi kumapangidwa ndi kusoketsa zotsogola pamodzi.Poyerekeza ndi kapangidwe koyambirira komwe chimango chotsogolera chimayikidwa pafupi ndi mbali ya chip, chip chikhoza kukhazikitsidwa mu phukusi la kukula komweko ndi m'lifupi mwake pafupifupi 1mm.
27. LQFP (paketi yotsika ya quad flat)
Thin QFP imatanthawuza ma QFP okhala ndi makulidwe a phukusi la 1.4mm, ndipo ndi dzina lomwe limagwiritsidwa ntchito ndi Japan Electronics Machinery Industry Association molingana ndi mawonekedwe atsopano a QFP factor factor.
28. L-QUAD
Imodzi mwa ma QFP a ceramic.Aluminiyamu nitride amagwiritsidwa ntchito pagawo la phukusi, ndipo matenthedwe apansi apansi ndi 7 mpaka 8 kuposa a aluminium okusayidi, kupereka kutentha kwabwinoko.Chophimba cha phukusicho chimapangidwa ndi aluminium oxide, ndipo chip chimasindikizidwa ndi njira yophika, motero kupondereza mtengo.Ndi phukusi lopangidwira logic LSI ndipo limatha kutenga mphamvu ya W3 pansi paziziziritso za mpweya wachilengedwe.Maphukusi a 208-pin (0.5mm center pitch) ndi 160-pin (0.65mm center pitch) a LSI logic apangidwa ndipo anapangidwa mochuluka mu October 1993.
29. MCM (multi-chip module)
Multi-chip module.Phukusi momwe ma semiconductor opanda tchipisi amasonkhanitsidwa pagawo la waya.Malinga ndi gawo lapansi, zitha kugawidwa m'magulu atatu, MCM-L, MCM-C ndi MCM-D.MCM-L ndi gulu lomwe limagwiritsa ntchito galasi la epoxy resin multilayer yosindikizidwa gawo lapansi.Ndiwocheperako komanso yotsika mtengo.MCM-C ndi gawo lomwe limagwiritsa ntchito ukadaulo wamakanema okhuthala kupanga mawaya angapo okhala ndi ceramic (alumina kapena galasi-ceramic) ngati gawo lapansi, lofanana ndi ma IC osakanizidwa amafilimu omwe amagwiritsa ntchito ma multilayer ceramic substrates.Palibe kusiyana kwakukulu pakati pa ziwirizi.Kuchuluka kwa mawaya ndikokwera kuposa kwa MCM-L.
MCM-D ndi gawo lomwe limagwiritsa ntchito ukadaulo wamafilimu opyapyala kupanga mawaya angapo okhala ndi ceramic (alumina kapena aluminium nitride) kapena Si ndi Al ngati magawo.Kuchuluka kwa mawaya ndipamwamba kwambiri pakati pa mitundu itatu ya zigawo, koma mtengo wake ndi wapamwamba.
30. MFP(mini flat package)
Small flat phukusi.Dzina lina la pulasitiki SOP kapena SSOP (onani SOP ndi SSOP).Dzina lomwe amagwiritsidwa ntchito ndi ena opanga semiconductor.
31. MQFP(metric quad flat package)
Gulu la ma QFP molingana ndi muyezo wa JEDEC (Joint Electronic Devices Committee).Zimatanthawuza ku QFP yokhazikika yokhala ndi mtunda wapakati wa pini wa 0.65mm ndi makulidwe a thupi a 3.8mm mpaka 2.0mm (onani QFP).
32. MQUAD(zitsulo zinayi)
Phukusi la QFP lopangidwa ndi Olin, USA.Chipinda choyambira ndi chivundikirocho chimapangidwa ndi aluminiyamu ndikumata ndi zomatira.Imatha kulola mphamvu ya 2.5W ~ 2.8W pansi pazikhalidwe zoziziritsa mpweya.Nippon Shinko Kogyo adapatsidwa chilolezo kuti ayambe kupanga mu 1993.
33. MSP(mini square package)
QFI alias (onani QFI), kumayambiriro kwa chitukuko, omwe amatchedwa MSP, QFI ndi dzina lolembedwa ndi Japan Electronics Machinery Industry Association.
34. OPMAC
Chonyamulira chosindikizira chosindikizira cha resin chosindikizidwa.Dzina logwiritsidwa ntchito ndi Motorola pakusindikiza kwa utomoni wa BGA (onani BGA).
35 P-(pulasitiki)
Imawonetsa zolemba za phukusi la pulasitiki.Mwachitsanzo, PDIP imatanthauza pulasitiki DIP.
36. PAC (pad array chonyamulira)
Bump display carrier, alias of BGA (onani BGA).
37. PCLP(gulu losindikizidwa lopanda leadless phukusi)
Losindikizidwa dera bolodi leadless phukusi.Pin center mtunda uli ndi mfundo ziwiri: 0.55mm ndi 0.4mm.Panopa mu gawo lachitukuko.
38. PFPF(pulasitiki lathyathyathya phukusi)
Phukusi lapulasitiki lathyathyathya.Dzina la pulasitiki QFP (onani QFP).Ena opanga LSI amagwiritsa ntchito dzinali.
39. PGA(pini gululi)
Pin array phukusi.Imodzi mwamaphukusi amtundu wa cartridge momwe zikhomo zoyimirira pansi pamunsi zimakonzedwa mwanjira yowonetsera.Kwenikweni, magawo a ceramic multilayer amagwiritsidwa ntchito pagawo la phukusi.Nthawi zomwe dzina lazinthu silinatchulidwe mwatsatanetsatane, ambiri ndi ma PGA a ceramic, omwe amagwiritsidwa ntchito pamabwalo othamanga kwambiri, omveka bwino a LSI.Mtengo wake ndi wokwera.Malo a pini nthawi zambiri amakhala 2.54mm motalikirana ndipo ma pini amawerengera kuyambira 64 mpaka 447. Kuti muchepetse mtengo, gawo lapansi la phukusi likhoza kusinthidwa ndi gawo lapansi losindikizidwa lagalasi epoxy.Pulasitiki PG A yokhala ndi ma 64 mpaka 256 ikupezekanso.Palinso pini yayifupi pamwamba pamtundu wa PGA (PGA yogwira-solder) yokhala ndi mtunda wapakati wa 1.27mm.(Onani mtundu wa PGA wokwera pamwamba).
40. Piggy kumbuyo
Phukusi lodzaza.Phukusi la ceramic lokhala ndi socket, lofanana ndi mawonekedwe a DIP, QFP, kapena QFN.Amagwiritsidwa ntchito popanga zida zokhala ndi ma microcomputer kuti aziwunika ntchito zotsimikizira pulogalamu.Mwachitsanzo, EPROM imayikidwa mu socket kuti iwonongeke.Phukusili ndilokhazikika ndipo silipezeka pamsika.
Nthawi yotumiza: May-27-2022