Mfundo zisanu ndi zitatu za PCBA manufacturability design

1. Kusonkhanitsidwa kwapamwamba komwe kumakondedwa ndi zigawo za crimping
Zida zophatikizira pamwamba ndi zida za crimping, ndiukadaulo wabwino.
Ndi chitukuko cha chigawo ma CD luso, zigawo zambiri zikhoza kugulidwa kwa reflow kuwotcherera magulu zigawo, kuphatikizapo pulagi-mu zigawo zikuluzikulu zomwe zingagwiritsidwe ntchito kupyolera dzenje reflow kuwotcherera.Ngati mapangidwewo atha kukwaniritsa msonkhano wathunthu wapadziko lonse lapansi, zimathandizira kwambiri kukonza bwino komanso kusonkhana.
Zigawo zopondapo zimakhala zolumikizira mapini ambiri.Kupaka kwamtunduwu kumakhalanso ndi kuthekera kwabwino komanso kudalirika kwa kulumikizana, komwenso ndi gulu lomwe limakondedwa.

2. Kutenga PCBA msonkhano pamwamba monga chinthu, ma CD sikelo ndi pini katayanitsidwe amaonedwa lonse.
Kuyika kwapackage ndi masitayilo a pini ndizofunikira kwambiri zomwe zimakhudza dongosolo lonselo.Pamaziko a kusankha pamwamba msonkhano zigawo zikuluzikulu, gulu la phukusi ndi katundu ofanana umisiri kapena oyenera phala kusindikiza zitsulo mauna makulidwe ena ayenera kusankhidwa kwa PCB ndi kukula yeniyeni ndi kachulukidwe msonkhano.Mwachitsanzo, bolodi la foni yam'manja, phukusi losankhidwa ndiloyenera kusindikiza phala ndi 0.1mm wandiweyani wachitsulo.

3. Kufupikitsa njira njira
Kufupikitsa njira ya ndondomekoyi, kumapangitsa kuti ntchito ikhale yabwino komanso yodalirika kwambiri.Njira yabwino kwambiri yopangira njira ndi:
Kuwotcherera kwa reflow kumodzi;
Kuwotcherera mbali ziwiri reflow;
Kuwotcherera mbali ziwiri + kuwotcherera kozungulira;
Kuwotcherera mbali ziwiri + zowotcherera zowotcherera zosankhidwa;
Kuwotcherera mbali ziwiri + kuwotcherera pamanja.

4. Konzani kamangidwe kagawo
Kapangidwe kagawo ka Principle Component kumatanthawuza kalembedwe kagawo ndi masitayilo.Mapangidwe a zigawo ayenera kukwaniritsa zofunikira za ndondomeko yowotcherera.Masanjidwe asayansi ndi omveka amatha kuchepetsa kugwiritsa ntchito ma solder oyipa ndi zida, ndikuwongolera mapangidwe azitsulo zachitsulo.

5. Ganizirani za mapangidwe a solder pad, kukana kwa solder ndi zenera lazitsulo zazitsulo
Mapangidwe a solder pad, kukana kwa solder ndi zenera lazitsulo lazitsulo zimatsimikizira kugawa kwenikweni kwa phala la solder ndi mapangidwe a solder olowa.Kugwirizanitsa mapangidwe a welding pad, kukana kuwotcherera ndi ma mesh achitsulo kumagwira ntchito yofunika kwambiri pakuwongolera kuchuluka kwa kuwotcherera.

6. Yang'anani pamapaketi atsopano
Otchedwa latsopano ma CD, si kwathunthu amatanthauza ma CD latsopano msika, koma amatanthauza kampani yawo alibe luso ntchito phukusi amenewo.Pakutumiza kwa mapaketi atsopano, kutsimikizika kwa batch yaing'ono kuyenera kuchitidwa.Ena angagwiritse ntchito, sizikutanthauza kuti mungagwiritsenso ntchito, kugwiritsa ntchito malowa kuyenera kuchitidwa zoyesera, kumvetsetsa machitidwe a ndondomeko ndi kuchuluka kwa zovuta, phunzirani zotsutsana.

7. Yang'anani pa BGA, chip capacitor ndi crystal oscillator
BGA, ma chip capacitor ndi ma crystal oscillator ndizomwe zimakhudzidwa ndi kupsinjika, zomwe ziyenera kupewedwa momwe zingathere mu PCB kupinda mapindikidwe pakuwotcherera, msonkhano, kusintha kwa ma workshop, mayendedwe, kugwiritsa ntchito ndi maulalo ena.

8. Phunzirani milandu kuti muwongolere malamulo apangidwe
Malamulo opanga mapangidwe amachokera ku machitidwe opanga.Ndikofunikira kwambiri kukhathamiritsa mosalekeza ndikuwongolera bwino malamulo apangidwe molingana ndi kukumana kosalekeza kwa kusonkhana kovutirapo kapena kulephera kukonza mapangidwe opanga.