I. Kufotokozera zakumbuyo
Makina opangira ma wave solderingkuwotcherera ndi mwa solder sungunuka pa chigawo zikhomo ntchito solder ndi Kutentha, chifukwa cha kayendedwe wachibale wa yoweyula ndi PCB ndi sungunuka solder "yomata", yoweyula soldering ndondomeko ndi zovuta kwambiri kuposa reflow soldering, kuti soldered phukusi. pini katayanidwe, pini kunja kutalika, pedi kukula chofunika, pa PCB Kamangidwe ka bolodi malangizo, katalikirana, komanso unsembe wa dzenje mzere alinso zofunika, mwachidule, yoweyula soldering ndondomeko osauka, wovuta, kuwotcherera. zokolola makamaka zimadalira kamangidwe.
II.Zofunikira pakuyika
1. oyenera ma wave soldering kuyika chinthu ayenera kukhala ndi solder mapeto kapena kutsogolo kutsogolo;Thupi la phukusi kuchokera pachilolezo cha pansi (Imani Off) <0.15mm;Kutalika <4mm zofunika zofunika.Kukwaniritsa zikhalidwe izi pazigawo zoyika zikuphatikizapo:
0603 ~ 1206 phukusi la kukula kwa zigawo za chip resistive.
SOP yokhala ndi mtunda wotsogolera ≥1.0mm ndi kutalika <4mm.
Ma chip inductors okhala ndi kutalika ≤ 4mm.
Ma coil chip inductors osawonekera (ie C, M mtundu)
2. oyenera kugwedeza mafunde a zigawo za cartridge ya wandiweyani pamtunda wocheperako pakati pa mapini oyandikana ≥ 1.75mm phukusi.
III.Njira yotumizira
Pamaso pa mafunde a soldering pamwamba chigawo masanjidwe, choyamba ayenera kudziwa PCB pa njira kufala ng'anjo, ndi masanjidwe a zigawo katiriji "ndondomeko benchmark".Choncho, pamaso yoweyula soldering pamwamba zigawo zikuluzikulu masanjidwe, woyamba ayenera kudziwa malangizo kufala.
1. Nthawi zambiri, mbali yayitali iyenera kukhala njira yotumizira.
2. Ngati masanjidwewo ali pafupi ndi phazi katiriji cholumikizira (phula <2.54mm), malangizo masanjidwe a cholumikizira ayenera kukhala malangizo kufala.
3. mu yoweyula soldering pamwamba, ayenera silika-screened kapena mkuwa zojambulazo Zinakhazikika muvi chosonyeza mmene kufala, kuti azindikire pamene kuwotcherera.
IV.Mayendedwe kamangidwe
Mayendedwe a masanjidwe a zigawozo makamaka amakhudza zigawo za chip ndi zolumikizira mapini angapo.
1. Kutalikira kwa phukusi la chipangizo cha SOP liyenera kukhala lofanana ndi masanjidwe amayendedwe amtundu wa soldering, mbali yayitali ya zigawo za chip, ziyenera kukhala zapakatikati panjira yotumizira mafunde.
2. angapo mapini awiri katiriji zigawo, jack center mzere malangizo ayenera perpendicular kwa njira kufala, kuti kuchepetsa chodabwitsa cha mbali imodzi ya chigawo choyandama.
V. Zofunikira pa malo
Pazigawo za SMD, ma pad spacing amatanthawuza nthawi yomwe ili pakati pa mawonekedwe apamwamba a mapaketi oyandikana nawo (kuphatikiza mapepala);pazigawo za cartridge, pad spacing imatanthawuza nthawi yapakati pa ma solder pads.
Pazigawo za SMD, masitayilo a pad sachokera kumalumikizidwe a mlatho, kuphatikiza kutsekereza kwa thupi la phukusi kungayambitse kutayikira kwa solder.
1. katiriji zigawo pad imeneyi ayenera zambiri kukhala ≥ 1.00mm.pa zolumikizira zabwino za cartridge, lolani kuchepetsa koyenera, koma osachepera sayenera kukhala <0.60mm.
2. mapepala a katiriji chigawo ndi zoweyula soldering SMD chigawo ziyangoyango ayenera kukhala ≥ 1.25mm interval.
VI.Pad kupanga zofunikira zapadera
1. pofuna kuchepetsa kutayikira soldering, kwa 0805/0603, SOT, SOP, tantalum capacitor pads, tikulimbikitsidwa kuti mapangidwe mogwirizana ndi zofunika zotsatirazi.
Pakuti 0805/0603 zigawo zikuluzikulu, malinga ndi IPC-7351 analimbikitsa mapangidwe (pad flare 0.2mm, m'lifupi kuchepetsedwa ndi 30%).
Kwa SOT ndi tantalum capacitor, mapepala ayenera kukulitsidwa kunja ndi 0.3mm poyerekeza ndi mapepala omwe amapangidwa kawirikawiri.
2. kwa mbale metalized dzenje, mphamvu ya olowa solder makamaka amadalira kugwirizana dzenje, pedi mphete m'lifupi ≥ 0.25mm kungakhale.
3. Kwa mbale yopanda zitsulo zopanda zitsulo (gulu limodzi), mphamvu ya mgwirizano wa solder imatsimikiziridwa ndi kukula kwa pad, kutalika kwa pedi kuyenera kukhala ≥ 2.5 nthawi ziwiri za dzenje.
4. Pa phukusi la SOP, liyenera kupangidwa kumapeto kwa zikhomo zomangira zikhomo, ngati phula la SOP ndilokulirapo, kupanga matani a malata amathanso kukhala okulirapo.
5. zolumikizira mapini angapo, ziyenera kupangidwa kumapeto kwa malata omwe abedwa.
VII.Kutulutsa kutalika
1. kutalika kwa kupangika kwa mlatho kumakhala ndi ubale wabwino, kucheperako kwa mapini, kumapangitsanso kukhudzika kwa malingaliro ambiri:
Ngati pini phula ili pakati pa 2 ~ 2.54mm, kutalika kokulirapo kuyenera kuyendetsedwa pa 0.8 ~ 1.3mm
Ngati pini phula <2mm, kutsogolera utali wautali ayenera kulamulidwa pa 0.5 ~ 1.0mm
2. kutsogolera kunja kutalika kokha mu gawo masanjidwe malangizo kukwaniritsa zofunika yoweyula zinthu soldering angathe kuchita nawo mbali, apo ayi kuthetsa zotsatira za kugwirizana mlatho si zoonekeratu.
VIII.kugwiritsa ntchito solder resist inki
1. Nthawi zambiri timawona malo ojambulira pad cholumikizira chosindikizidwa ndi zithunzi za inki, mapangidwe otere nthawi zambiri amawoneka kuti amachepetsa zochitika za mlatho.Limagwirira angakhale inki wosanjikiza pamwamba ndi ndi akhakula, zosavuta adsorb kwambiri kuchulukirachulukira, flux anakumana ndi kutentha kusungunuka solder volatilization ndi mapangidwe kudzipatula thovu, potero kuchepetsa zochitika za bridging.
2. Ngati mtunda pakati pa pini ziyango <1.0mm, inu mukhoza kupanga solder kukana inki wosanjikiza kunja ziyangoyango kuchepetsa Mwina wa mlatho, amene makamaka kuthetsa wandiweyani ziyangoyango pakati pa solder olowa mlatho, ndi kuba malata. ziyangoyango makamaka kuthetsa wandiweyani PAD gulu otsiriza desoldering mapeto a solder olowa mlatho ntchito zawo zosiyanasiyana.Chifukwa chake, popeza malo otsetsereka a pini ndi ochepa kwambiri, muyenera kugwiritsa ntchito inki ya solder ndi kuba kwa solder pad.
Nthawi yotumiza: Dec-14-2021