Kodi Ubwino ndi Kuipa kwa BGA Packaged ndi Chiyani?

I. BGA mmatumba ndi ndondomeko ma CD ndi zofunika kwambiri kuwotcherera pa PCB kupanga.Ubwino wake ndi motere:
1. Pini yayifupi, kutalika kwa msonkhano wochepa, inductance yaing'ono ya parasitic ndi capacitance, ntchito yabwino kwambiri yamagetsi.
2. Kuphatikizana kwapamwamba kwambiri, zikhomo zambiri, malo akuluakulu a pini, pini yabwino ya coplanar.Malire a malo a pini a electrode ya QFP ndi 0.3mm.Posonkhanitsa bolodi lozungulira lopangidwa ndi welded, kulondola kwa chipangizo cha QFP ndizovuta kwambiri.Kudalirika kwa kulumikizana kwamagetsi kumafuna kulolerana kokwera kukhala 0.08mm.Zikhomo za elekitirodi za QFP zokhala ndi katalikirana kocheperako ndizoonda komanso zosalimba, zosavuta kupotoza kapena kusweka, zomwe zimafuna kuti kufanana ndi kulinganiza pakati pa zikhomo za board board ziyenera kutsimikizika.Mosiyana, phindu lalikulu la phukusi la BGA ndiloti 10-electrode pini yotalikirana ndi yaikulu, mipata yofanana ndi 1.0mm.1.27mm, 1.5mm (Inchi 40mil, 50mil, 60mil), kulolerana ndi 0.3mm, ndi mipikisano wamba -zogwira ntchitomakina a SMTndireflow uvuniakhoza kwenikweni kukwaniritsa zofunika za BGA msonkhano.

II.Ngakhale BGA encapsulation ili ndi zabwino zomwe zili pamwambapa, ilinso ndi zovuta zotsatirazi.Izi ndizovuta za BGA encapsulation:
1. Ndizovuta kuyendera ndi kusunga BGA pambuyo kuwotcherera.Opanga PCB ayenera kugwiritsa ntchito X-ray fluoroscopy kapena X-ray layering kuyendera kuti atsimikizire kudalirika kwa kugwirizana kwa bolodi yowotcherera, ndipo mtengo wake ndi wapamwamba.
2. Malumikizidwe a solder a gulu la dera amathyoledwa, kotero chigawo chonsecho chiyenera kuchotsedwa, ndipo BGA yochotsedwayo singagwiritsidwenso ntchito.