Chifukwa Chiyani Tiyenera Kudziwa Zokhudza Packaging Yotsogola?

Cholinga cha semiconductor chip phukusi ndikuteteza chip palokha ndikulumikiza ma siginecha pakati pa tchipisi.Kwa nthawi yayitali m'mbuyomu, kuwongolera magwiridwe antchito a chip makamaka kudali kuwongolera kapangidwe kake ndi kupanga.

Komabe, momwe mawonekedwe a transistor a tchipisi ta semiconductor adalowa mu nthawi ya FinFET, kupita patsogolo kwa njirayo kunawonetsa kuchepa kwakukulu pazochitikazo.Ngakhale molingana ndi mapu a chitukuko cha makampani, pali malo ambiri oti ndondomekoyi ipitirire kukwera, tikhoza kumva pang'onopang'ono kwa Chilamulo cha Moore, komanso kupanikizika komwe kumabwera chifukwa cha kuchuluka kwa ndalama zopangira.

Zotsatira zake, zakhala njira yofunikira kwambiri yopititsira patsogolo mwayi wowongolera magwiridwe antchito pokonzanso ukadaulo wamapaketi.Zaka zingapo zapitazo, makampaniwa adatulukira kudzera muukadaulo wamapaketi apamwamba kuti akwaniritse mawu akuti "kupitirira Moore (Kuposa Moore)"!

Zomwe zimatchedwa kulongedza kwapamwamba, tanthawuzo lamakampani ambiri ndilo: kugwiritsa ntchito njira zonse zopangira njira zamakono zopangira zipangizo zamakono.

Pogwiritsa ntchito mapepala apamwamba, tingathe:

1. Kuchepetsa kwambiri dera la chip mutatha kulongedza

Kaya ndi kuphatikiza kwa tchipisi tambiri, kapena phukusi limodzi la chip Wafer Levelization, limatha kuchepetsa kwambiri kukula kwa phukusili kuti muchepetse kugwiritsa ntchito gawo lonse la board.Kugwiritsira ntchito kulongedza kumatanthauza kuchepetsa dera la chip mu chuma kusiyana ndi kupititsa patsogolo ndondomeko ya kutsogolo kuti ikhale yotsika mtengo.

2. Khalani ndi madoko ambiri a chip I/O

Chifukwa cha kukhazikitsidwa kwa njira yakutsogolo, titha kugwiritsa ntchito ukadaulo wa RDL kuti tipeze zikhomo zambiri za I/O pagawo lililonse la chip, motero kuchepetsa kuwonongeka kwa chip area.

3. Chepetsani mtengo wonse wopanga chip

Chifukwa cha kukhazikitsidwa kwa Chiplet, titha kuphatikiza tchipisi tambiri ndi ntchito zosiyanasiyana ndikukonza matekinoloje/node kuti tipange dongosolo-mu-package (SIP).Izi zimapewa njira yotsika mtengo yogwiritsa ntchito njira yomweyo (yapamwamba kwambiri) pazochita zonse ndi ma IP.

4. Limbikitsani kulumikizana pakati pa tchipisi

Pamene kufunikira kwa mphamvu zazikulu zamakompyuta kukuchulukirachulukira, m'magawo ambiri ogwiritsira ntchito ndikofunikira kuti makina apakompyuta (CPU, GPU…) ndi DRAM azitha kusinthana zambiri.Izi nthawi zambiri zimapangitsa kuti pafupifupi theka la magwiridwe antchito komanso kugwiritsa ntchito mphamvu kwadongosolo lonse kuwonongeke pazolumikizana zazidziwitso.Tsopano popeza titha kuchepetsa kutayika uku kukhala osachepera 20% mwa kulumikiza purosesa ndi DRAM moyandikana momwe tingathere kudzera m'mapaketi osiyanasiyana a 2.5D/3D, titha kuchepetsa kwambiri mtengo wamakompyuta.Kuwonjezeka kwa lusoli kumaposa kupita patsogolo komwe kwachitika potengera njira zotsogola zopangira zinthu

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Zhejiang NeoDen Technology Co., LTD., idakhazikitsidwa mu 2010 ndi antchito 100+ & 8000+ Sq.m.fakitale ya ufulu wodziyimira pawokha wa katundu, kuwonetsetsa kasamalidwe koyenera ndikukwaniritsa zotsatira zachuma komanso kupulumutsa mtengo.

Ali ndi malo opangira makina, ophatikiza aluso, oyesa ndi akatswiri a QC, kuti atsimikizire luso lamphamvu la makina a NeoDen opangira, abwino komanso operekera.

Aluso komanso akatswiri othandizira achingerezi&akatswiri a ntchito, kuwonetsetsa kuyankha mwachangu mkati mwa maola 8, yankho limapereka mkati mwa maola 24.

Wapadera pakati pa opanga onse aku China omwe adalembetsa ndikuvomereza CE ndi TUV NORD.


Nthawi yotumiza: Sep-22-2023

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