Chip Component Pad Design Zowonongeka

1. 0.5mm phula la QFP pad kutalika ndi lalitali kwambiri, zomwe zimapangitsa kuti zikhale zochepa.

2. PLCC socket pads ndi lalifupi kwambiri, zomwe zimapangitsa kuti pakhale soldering zabodza.

3. Utali wa IC's pad ndi wautali kwambiri ndipo kuchuluka kwa solder phala ndi kwakukulu zomwe zimapangitsa kuti pakhale mawonekedwe afupiafupi pa reflow.

4. Mapiko opangidwa ndi mapiko a chip ndi aatali kwambiri kuti asakhudze kudzaza chidendene ndi kunyowetsa chidendene.

5. Kutalika kwa pad kwa zigawo za chip ndi zazifupi kwambiri, zomwe zimapangitsa kusuntha, kuzungulira kotseguka, sikungagulitsidwe ndi zovuta zina zogulitsira.

6. Kutalika kwa pedi ya zigawo zamtundu wa chip ndi motalika kwambiri, zomwe zimapangitsa kuti chipilala choyima, chigawo chotseguka, cholumikizira cha solder chichepetse malata ndi zovuta zina zogulitsira.

7. Pad m'lifupi mwake ndi yotakata kwambiri zomwe zimapangitsa kuti chigawocho chisamuke, solder chopanda kanthu komanso malata osakwanira pa pad ndi zolakwika zina.

8. Pad m'lifupi ndi yotakata kwambiri, chigawo cha phukusi kukula ndi kusagwirizana pad.

9. Pad m'lifupi ndi yopapatiza, zimakhudza kukula kwa solder wosungunuka pamodzi chigawo solder mapeto ndi zitsulo pamwamba wetting kufalikira pa PCB PAD osakaniza, zimakhudza mawonekedwe a solder olowa, kuchepetsa kudalirika kwa solder olowa.

10. Pad yolumikizidwa mwachindunji kudera lalikulu la zojambulazo zamkuwa, zomwe zimapangitsa kuti chipilala choyima, solder yonyenga ndi zolakwika zina.

11. Pad phula ndi lalikulu kwambiri kapena laling'ono kwambiri, chigawo solder mapeto sangagwirizane ndi pad alipo, adzatulutsa chipilala, kusamuka, solder zabodza ndi zolakwika zina.

12. Pad pitch ndi yaikulu kwambiri zomwe zimapangitsa kuti zisapange mgwirizano wa solder.

NeoDen SMT Production line


Nthawi yotumiza: Dec-16-2021

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