Circuit Board Thermal Conductivity and Heat Dissipation Design Processability Requirements

1. Kutentha kwakuya mawonekedwe, makulidwe ndi dera la mapangidwe

Malinga ndi matenthedwe kamangidwe amafuna zigawo zikuluzikulu kutentha dispation ayenera kuganiziridwa mokwanira, ayenera kuonetsetsa kuti mphambano kutentha kwa zigawo kutentha-kutulutsa, PCB pamwamba kutentha kukumana mankhwala kapangidwe zofunika.

2. Kutentha kwakuya kokweza pamwamba pa roughness kamangidwe

Pazofunikira zowongolera kutentha kwazinthu zopangira kutentha kwakukulu, zowukira kutentha ndi zigawo za kuuma kwapamtunda ziyenera kutsimikiziridwa kuti zifika 3.2µm kapena 1.6µm, zakulitsa malo olumikizana ndi chitsulo, kugwiritsa ntchito mokwanira matenthedwe apamwamba. za zinthu zitsulo makhalidwe, kuchepetsa kukhudzana matenthedwe kukana.Koma kawirikawiri, roughness sikuyenera kufunikira kwambiri.

3. Kudzaza kusankha zinthu

Kuti muchepetse kukana kwamafuta okhudzana ndi gawo lapamwamba lamphamvu yokwera pamwamba ndi kuzama kwa kutentha, mawonekedwe opangira mawonekedwe ndi zida zotenthetsera matenthedwe, zida zopangira matenthedwe zodzaza ndi ma conductivity apamwamba amafuta ziyenera kusankhidwa, mwachitsanzo, kutchinjiriza ndi ma conductivity matenthedwe. zipangizo monga beryllium okusayidi (kapena aluminium trioxide) ceramic pepala, polyimide filimu, mica pepala, zodzaza zinthu monga thermally conductive silikoni girisi, chigawo chimodzi vulcanized silikoni mphira, awiri chigawo thermally conductive silikoni mphira, thermally conductive silikoni mphira pad.

4. Unsembe kukhudzana pamwamba

Kuyika popanda kutchinjiriza: chigawo chokwera pamwamba → choyikira chotenthetsera → PCB, malo olumikizana ndi magawo awiri.
Kuyika kwa insulated: chigawo chokwera pamwamba → choyikira chotenthetsera pamwamba → chosanjikiza chotchinga → PCB (kapena chipolopolo cha chassis), magawo atatu olumikizana.Insulation wosanjikiza anaika amene mlingo, ayenera zochokera chigawo chimodzi pamwamba kapena PCB padziko magetsi kutchinjiriza zofunika.