PCB Board Substrate Material Gulu

Mitundu yambiri yamagawo omwe amagwiritsidwa ntchito pa PCBs, koma mokulirapo amagawidwa m'magulu awiri, omwe ndi zinthu zapansi panthaka ndi zinthu zapansi panthaka.

Inorganic gawo lapansi

Zachilengedwe gawo lapansi makamaka mbale zadothi, ceramic dera gawo lapansi zakuthupi ndi 96% aluminiyamu, pa nkhani yofuna mkulu mphamvu gawo lapansi, 99% koyera aluminiyamu angagwiritsidwe ntchito koma mkulu-chiyero zotayidwa zovuta processing, mlingo zokolola ndi otsika, kotero the kugwiritsa ntchito mtengo wa aluminiyamu koyera ndikokwera kwambiri.Beryllium okusayidi ndi zinthu za ceramic gawo lapansi, ndi okusayidi zitsulo, ali ndi mphamvu kutchinjiriza magetsi katundu ndi matenthedwe matenthedwe madutsidwe, angagwiritsidwe ntchito ngati gawo lapansi pa mabwalo mkulu kachulukidwe mphamvu.

Magawo a Ceramic circuit amagwiritsidwa ntchito makamaka m'mabwalo ophatikizika amtundu wakuda ndi woonda wosakanizidwa, mabwalo ang'onoang'ono ang'onoang'ono, omwe ali ndi zabwino zomwe magawo azinthu zakuthupi sangafanane.Mwachitsanzo, CTE ya gawo lapansi la dera la ceramic lingafanane ndi CTE ya nyumba ya LCCC, kotero kudalirika kwa mgwirizano wabwino wa solder kudzapezedwa pakusonkhanitsa zida za LCCC.Kuphatikiza apo, magawo a ceramic ndi oyenera kutulutsa mpweya wa vacuum mukupanga chip chifukwa samatulutsa mpweya wochuluka wa adsorbed womwe umayambitsa kuchepa kwa vacuum ngakhale utatenthedwa.Kuphatikiza apo, magawo a ceramic amakhalanso ndi kukana kutentha kwambiri, kutsirizika kwabwino pamtunda, kukhazikika kwamankhwala, ndiye gawo loyendera dera lomwe limakondedwa ndi ma circulation osakanizidwa amafilimu okhuthala komanso ma multi-chip micro-assembly.Komabe, n'zovuta pokonza mu gawo lapansi lalikulu ndi lathyathyathya, ndipo sangapangidwe kukhala Mipikisano chidutswa kuphatikiza sitampu bolodi dongosolo kukwaniritsa zosoweka kupanga yodzichitira Komanso, chifukwa chachikulu dielectric nthawi zonse za ceramic zipangizo, kotero izo. sichilinso choyenera kwa magawo othamanga kwambiri, ndipo mtengo wake ndi wokwera kwambiri.

organic gawo lapansi zipangizo

Zida za gawo lapansi za organic zimapangidwa ndi zida zolimbikitsira monga nsalu zamagalasi (mapepala a fiber, mphasa wagalasi, ndi zina), zoyikidwa ndi utomoni binder, zowumitsidwa popanda kanthu, kenako zokutidwa ndi zojambulazo zamkuwa, zopangidwa ndi kutentha kwambiri komanso kupanikizika.Mtundu uwu wa gawo lapansi umatchedwa copper-clad laminate (CCL), yomwe imadziwika kuti copper-clad panels, ndiye chinthu chachikulu chopangira ma PCB.

CCL mitundu yambiri, ngati kulimbikitsa zinthu zomwe zimagwiritsidwa ntchito kugawanitsa, zikhoza kugawidwa m'magulu opangidwa ndi mapepala, magalasi opangidwa ndi nsalu, makina osakanikirana (CEM) ndi magulu anayi azitsulo;malinga ndi organic resin binder ntchito kugawa, ndipo akhoza kugawidwa mu phenolic utomoni (PE) epoxy utomoni (EP), polyimide utomoni (PI), polytetrafluoroethylene utomoni (TF) ndi polyphenylene etha utomoni (PPO);ngati gawo lapansili ndi lolimba komanso losavuta kugawa, ndipo lingathe kugawidwa mu CCL yolimba ndi CCL yosinthika.

Panopa chimagwiritsidwa ntchito kupanga awiri mbali PCB ndi epoxy galasi CHIKWANGWANI dera gawo lapansi, amene Chili ubwino wa mphamvu zabwino za galasi CHIKWANGWANI ndi epoxy utomoni kulimba, ndi mphamvu zabwino ndi ductility.

Epoxy glass fiber circuit gawo lapansi limapangidwa ndikuyamba kulowetsa epoxy resin munsalu yamagalasi kuti apange laminate.Panthawi imodzimodziyo, mankhwala ena amawonjezedwa, monga machiritso, stabilizers, anti-flammability agents, zomatira, ndi zina zotero. Kenako zojambulazo zamkuwa zimamatidwa ndikukanikizidwa kumbali imodzi kapena zonse ziwiri za laminate kuti apange galasi lagalasi la epoxy. laminate.Itha kugwiritsidwa ntchito kupanga ma PCB osiyanasiyana ambali imodzi, am'mbali-mbali komanso amitundu yambiri.