Zofunikira pa Mapangidwe a Mapangidwe a Zigawo za Wave Soldering Surface

1. Mbiri

Wave soldering umagwiritsidwa ntchito ndikuwotchedwa ndi solder wosungunuka ku zikhomo za zigawo.Chifukwa cha kusuntha kwa ma wave crest ndi PCB ndi "kumamatira" kwa solder yosungunuka, njira yowotchera mafunde imakhala yovuta kwambiri kuposa kuwotchereranso.Pali zofunika kuti mapini atalikirane, kutalika kwa pini ndi kukula kwa paketi yowotcherera.Palinso zofunika kwa masanjidwe malangizo, katayanitsidwe ndi kugwirizana kwa mabowo okwera pa PCB bolodi pamwamba.Mwachidule, njira yopangira ma wave soldering ndi yochepa kwambiri ndipo imafuna khalidwe lapamwamba.Zokolola za kuwotcherera zimatengera kapangidwe.

2. Zofunikira pakuyika

a.Zida zopangira phiri zoyenera kutenthetsa mafunde ziyenera kukhala ndi zowotcherera kapena zotsogola zowonekera;Phukusi chilolezo pansi thupi (Imani Off) <0.15mm;Kutalika <4mm zofunika zofunika.

Zokwera zomwe zimakwaniritsa izi ndi izi:

0603 ~ 1206 chip kukana ndi zinthu za capacitance mkati mwa kukula kwa phukusi;

SOP yokhala ndi mtunda wotsogolera ≥1.0mm ndi kutalika <4mm;

Chip inductor ndi kutalika ≤4mm;

Chojambulira tchipisi cha coil (mtundu C, M)

b.Cholumikizira cha pini chophatikizika chomwe chili choyenera kuzunguliridwa ndi ma wave soldering ndi phukusi lomwe lili ndi mtunda wochepera pakati pa mapini oyandikana ≥1.75mm.

[Ndemanga]Kutalikirana kochepera kwa zigawo zomwe zayikidwa ndi malo ovomerezeka opangira ma wave soldering.Komabe, kukwaniritsa malo ocheperako sikutanthauza kuti kuwotcherera kwapamwamba kungathe kukwaniritsidwa.Zofunikira zina monga momwe masanjidwe ake, kutalika kwa nsonga yowotcherera, ndi matayala otalikirana ayeneranso kukwaniritsidwa.

Chip mount element, phukusi kukula <0603 si oyenera yoweyula soldering, chifukwa kusiyana pakati pa malekezero awiri a chinthu ndi laling'ono kwambiri, zosavuta kuchitika pakati pa malekezero awiri a mlatho.

Chip mount element, kukula kwa phukusi> 1206 sikoyenera kutenthetsa mafunde, chifukwa kutenthetsa kwa mafunde ndikotentha kosafanana, kukula kwakukulu kwa chip resistance ndi capacitance element ndikosavuta kusweka chifukwa cha kufalikira kwamafuta.

3. Njira yotumizira

Pamaso pa masanjidwe a zigawo pa wave soldering pamwamba, mayendedwe a PCB kudzera mu ng'anjo amayenera kudziwidwa kaye, komwe ndi "ndondomeko yolozera" pamasanjidwe a zigawo zomwe zayikidwa.Choncho, malangizo a kufala ayenera kutsimikiziridwa pamaso masanjidwe a zigawo zikuluzikulu pa yoweyula soldering pamwamba.

a.Nthawi zambiri, njira yotumizira iyenera kukhala mbali yayitali.

b.Ngati masanjidwewo ali ndi cholumikizira cha pini chowundana (kutalika <2.54mm), mayendedwe a cholumikizira ayenera kukhala njira yotumizira.

c.Pamwamba pa solder, nsalu yotchinga ya silika kapena mivi yamkuwa yokhotakhota imagwiritsidwa ntchito kuyika komwe kumapatsirana kuti izindikirike pakuwotcherera.

[Ndemanga]Kuwongolera kwagawo ndikofunikira kwambiri pakuwotchera mafunde, chifukwa ma wave soldering amakhala ndi malata mkati ndi kunja.Choncho, kupanga ndi kuwotcherera ziyenera kukhala mbali imodzi.

Ichi ndi chifukwa chake cholembera mayendedwe a ma wave soldering transmission.

Ngati mutha kudziwa komwe mungayendere, monga kapangidwe ka pini yabedwa, njira yopatsirana siidziwika.

4. Mayendedwe a masanjidwe

Kayendetsedwe kagawo ka zigawo makamaka kumakhudza zigawo za chip ndi zolumikizira mapini angapo.

a.Njira yayitali ya PACKAGE ya zida za SOP iyenera kukonzedwa mofanana ndi njira yotumizira yowotcherera nsonga yowotcherera, ndipo mbali yayitali ya zigawo za chip ziyenera kukhala zogwirizana ndi njira yotumizira yowotcherera pachimake.

b.Pakuti angapo mapini awiri pulagi-mu zigawo zikuluzikulu, kugwirizana malangizo a jack center ayenera kukhala perpendicular kwa njira kufala kuchepetsa choyandama choyandama cha mbali imodzi ya chigawo chimodzi.

[Ndemanga]Chifukwa gulu la phukusi la chigambacho limatchinga pa solder yosungunuka, ndikosavuta kutsogolera pakuwotcherera kwa zikhomo kumbuyo kwa phukusi (mbali ya destin).

Choncho, amafuna ambiri a ma CD thupi sikukhudza malangizo a otaya wosungunuka solder masanjidwe.

Kulumikiza kwa zolumikizira mapini angapo kumachitika makamaka kumapeto / mbali ya pini.Kuyanjanitsa kwa zikhomo zolumikizira komwe kumapatsira kumachepetsa kuchuluka kwa zikhomo, ndipo pamapeto pake, kuchuluka kwa Bridges.Ndiyeno kuchotsa mlatho kwathunthu kudzera kamangidwe ka kubedwa malata PAD.

5. Zofunikira za malo

Pazigawo za zigamba, masitayilo a pad amatanthawuza katayanidwe pakati pa zinthu zomwe zimadumphira kwambiri (kuphatikiza mapepala) a phukusi loyandikana;Pazigawo za pulagi, kusiyana kwa pad kumatanthawuza mpata pakati pa ma padi.

Pazigawo za SMT, ma pad spacing sikuti amangoganiziridwa kuchokera pa mlatho, komanso kumaphatikizapo kutsekereza kwa thupi la phukusi lomwe lingayambitse kuwotcherera.

a.Kutalikirana kwa mapadi pazigawo za pulagi nthawi zambiri kuyenera kukhala ≥1.00mm.Kwa zolumikizira zolumikizira bwino, kuchepetsa pang'ono kumaloledwa, koma kucheperako kuyenera kukhala kosachepera 0.60mm.
b.Nthawi yapakati pa pulagi ya zida za pulagi ndi pad ya ma wave soldering patch iyenera kukhala ≥1.25mm.

6. Zofunikira zapadera pamapangidwe a pad

a.Pofuna kuchepetsa kuwotcherera kutayikira, tikulimbikitsidwa kupanga mapepala a 0805/0603, SOT, SOP ndi tantalum capacitors malinga ndi izi.

Pazigawo za 0805/0603, tsatirani kapangidwe kake ka IPC-7351 (pad yokulitsidwa ndi 0.2mm ndi m'lifupi kuchepetsedwa ndi 30%).

Kwa SOT ndi tantalum capacitor, mapepala akuyenera kukulitsidwa 0.3mm kunja kuposa omwe amapangidwira bwino.

b.kwa mbale metallized dzenje, mphamvu ya olowa solder makamaka zimadalira kugwirizana dzenje, m'lifupi mphete mphete ≥0.25mm.

c.Kwa mabowo opanda zitsulo (pagulu limodzi), kulimba kwa cholumikizira cholumikizira kumadalira kukula kwa pad, nthawi zambiri kutalika kwa pedi kuyenera kupitilira nthawi 2.5 pobowola.

d.Pakuyika kwa SOP, pad yakuba malata iyenera kupangidwa kumapeto kwa pini ya destin.Ngati malo a SOP ndi ochulukirapo, mapangidwe a malata akuba amathanso kukhala okulirapo.

e.kwa cholumikizira cha mapini angapo, chiyenera kupangidwa kumapeto kwa malata a malata.

7. kutsogolera kutalika

a.Utali wotsogola umakhala ndi ubale wabwino kwambiri ndi mapangidwe a kulumikizana kwa mlatho, kucheperako kwa mapini, kukopa kwakukulu.

Ngati malo a pini ali 2 ~ 2.54mm, kutalika kwake kuyenera kuyendetsedwa mu 0.8 ~ 1.3mm.

Ngati mipata ya pini ili yosakwana 2mm, kutalika kwake kuyenera kuyendetsedwa mu 0.5 ~ 1.0mm.

b.Kutalikirana kwa chiwongolerocho kumatha kugwira ntchito pokhapokha ngati gawo loyang'anira gawo likukwaniritsa zofunikira za soldering yoweyula, apo ayi zotsatira za kuchotsa mlatho sizikuwonekera.

[Ndemanga]Mphamvu ya kutalika kwa kutsogolera pamalumikizidwe a mlatho ndizovuta kwambiri, nthawi zambiri> 2.5mm kapena <1.0mm, chikoka pa kulumikizana kwa mlatho ndi chochepa, koma pakati pa 1.0-2.5m, chikokacho chimakhala chachikulu.Ndiko kuti, ndiye kuti nthawi zambiri zimayambitsa zochitika za bridging pomwe sizili zazitali kapena zazifupi kwambiri.

8. Kugwiritsa ntchito inki yowotcherera

a.Nthawi zambiri timawona zojambula zojambulira zosindikizidwa za inki, mapangidwe otere amakhulupilira kuti amachepetsa zomwe zimachitika.Limagwirira angakhale kuti pamwamba pa inki wosanjikiza ndi akhakula, zosavuta kuyamwa zambiri flux, flux mu kutentha wosungunuka solder volatilization ndi mapangidwe kudzipatula thovu, kuti kuchepetsa zochitika za bridging.

b.Ngati mtunda pakati pa pini ziyango <1.0mm, mukhoza kupanga solder kutsekereza inki wosanjikiza kunja PAD kuchepetsa mwayi wa bridging, makamaka kuthetsa wandiweyani PAD pakati pa mlatho pakati pa mfundo solder, ndi waukulu. kuchotsa wandiweyani PAD gulu kumapeto kwa mlatho solder olowa ntchito zawo zosiyanasiyana.Chifukwa chake, pakusiyanitsidwa kwa mapini ndikocheperako, muyenera kugwiritsa ntchito inki ya solder ndi pedi yakuba.

K1830 SMT mzere wopanga


Nthawi yotumiza: Nov-29-2021

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